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IRFNJ9130 irf9130smd05 semelab plc. telephone +44(0)1455) 556565. fax +44(0)1455) 552612. e-mail: sales@semelab.co.uk website http://www.semelab.co.uk document number 5544 issue 1 v gs gate ? source voltage i d continuous drain current @ t case = 25c i d continuous drain current @ t case = 100c i dm pulsed drain current p d power dissipation @ t case = 25c linear derating factor t j , t stg operating and storage temperature range r jc thermal resistance junction to case 20v -11a -7a -50a 45w 0.36w/c ?55 to 150c 2.8c/w max. mechanical data dimensions in mm (inches) 2 1 3 2.41 (0.095) (0.030) min. 3.05 (0.120) 5.72 (.225) 0.127 (0.005) (0.296) 10.16 (0.400) 0.76 (0.030) min. 3.175 (0.125) max. 0.50 (0.020) max. 7.54 0.76 2.41 (0.095) 0.127 (0.005) (0.286) 7.26 16 plcs 0.50(0.020) 0.127 (0.005) absolute maximum ratings (t case = 25 c unless otherwise stated) smd05 (to-276aa) p?channel power mosfet for hi?rel applications features hermetically sealed simple drive requirements lightweight screening options available all leads isolated from case v dss -100v i d(cont) -11a r ds(on) 0.30 ? ? irf9130smd05 IRFNJ9130 pad1 = gate pad 2 drain pad3 = source pad1 = source pad 2 = drain pad3 = gate semelab plc reserves the right to change test conditions, parameter limits and package dimensions without notice. information f urnished by semelab is believed to be both accurate and reliable at the time of going to press. however semelab assumes no responsibility for any errors or omi ssions discovered in its use. semelab encourages customers to verify that datasheets are current before placing orders.
semelab plc. telephone +44(0)1455) 556565. fax +44(0)1455) 552612. e-mail: sales@semelab.co.uk website http://www.semelab.co.uk parameter test conditions min. typ. max. unit v gs = 0 i d = -1ma reference to 25 c i d = -1ma v gs = -10v i d = -7a v gs = -10v i d = -11a v ds = v gs i d = -250 a v ds -15v i ds = -7a v gs = 0 v ds = -80v t j = 125 c v gs = -20v v gs = 20v v gs = 0 v ds = 25v f = 1mhz v gs = -10v v ds = -50v i d = -11a v dd = -50v i d = -11a r g = 7.5 ? i s = -11a t j = 25 c v gs = 0 i s = -11a t j = 25 c d i / d t -100a/ sv dd 150v electrical characteristics (t c = 25 c unless otherwise stated) drain ? source breakdown voltage temperature coefficient of breakdown voltage static drain ? source on ? state resistance gate threshold voltage forward transconductance zero gate voltage drain current forward gate ? source leakage reverse gate ? source leakage input capacitance output capacitance reverse transfer capacitance total gate charge gate ? source charge gate ? drain ( ? miller ? ) charge turn ? on delay time rise time turn ? off delay time fall time continuous source current pulse source current diode forward voltage reverse recovery time reverse recovery charge -100 -0.1 0.30 0.35 -2 -4 3 -25 -250 -100 100 860 350 125 29 7.1 21 60 140 140 140 -11 -50 -4.7 250 3 v v/ c ? v s ( ? a na pf nc ns a v ns c bv dss ? bv dss ? t j r ds(on) v gs(th) g fs i dss i gss i gss c iss c oss c rss q g q gs q gd t d(on) t r t d(off) t f i s i sm v sd t rr q rr static electrical ratings dynamic characteristics source ? drain diode characteristics ( ? ) semelab plc reserves the right to change test conditions, parameter limits and package dimensions without notice. information f urnished by semelab is believed to be both accurate and reliable at the time of going to press. however semelab assumes no responsibility for any errors or omi ssions discovered in its use. semelab encourages customers to verify that datasheets are current before placing orders. document number 5544 issue 1 IRFNJ9130 irf9130smd05
high reliability and screening options
doc 2624 iss 5 contents 1. introduction.......... ................... ................... ................... ................ ............. 1 2. quality approvals ...................................................................................... 2 3. material qualification................................................................................. 3 3.1 header/cap/wire approval procedures ..................................................................... 3 3.2 die approval procedure .............................................................................................. 4 4. cecc (discrete products)................ ................ ................ ................ ......... 5 4.1 inspection levels for cecc fully assessed devices .............................................. 5 4.2 cecc screening options ............................................................................................ 7 5. bs (linear products) ................................................................................. 8 5.1 inspection levels for bs fully assessed devices ................................................... 8 5.2 bs screening options (linear ic?s) ......................................................................... 10 6. dscc / 883b (linear products)........... ................ ................ ................ .....11 6.1 inspection levels for dscc smd listed devices .................................................... 11 6.2 screening sequence for dscc smd listed devices ............................................... 13 7. esa - escc - space level products .. ................... ................... .............. 14 7.1 chart f2 - production control... .................... .................... ............... ............... ......... 14 7.2 chart f3 - screening tests....................................................................................... 15 7.3 chart f4 - qualification and periodic tests........................................................... 16 8. semelab in-house processing options ................................................. 17 8.1 cecc processed devices (qr208, qr209) ............................................................. 17 8.2 bs and cv processed devices (bipolar).................................................................. 18 8.3 mil-prf-19500 processed discrete semiconductors (qr205, qr204) ............... 19 8.3.1 qr205 - inspection levels: ?mil pr ocessed? quality c onformance ....... 20 8.3.2 qr204 - screening sequences ?mil processed? components............... 22 8.4 space level processed discrete semic onductors (qr216, qr217) .................... 23 8.4.1 qr217 - inspection levels: ?space level processed? conformance..... 24 8.4.2 qr216 - screening: space level processed? components................... 25 8.4.3 comparison of space level die lot approval ............................................ 27 8.5 mil-883b processed integrated circuits (qr214, qr215)..................................... 28 8.6 customer specifications ........................................................................................... 28 8.7 data sheets ............................................................................................................... .. 28 9. comparison of screening options......................................................... 29 9.1 comparison hi-rel screening options .................................................................... 30 9.2 comparison of space level screening options ..................................................... 30 issue 10b (dmd) 04/06
1 doc 2624 iss 5 1. introduction experience and innovation in semiconductor technology at semelab, we research, design, manufacture and distribute an innovative range of semiconductor products throughout the world. our r&d teams have an excellent track re cord for developing imaginative electronic solutions. our design engineers have created a wealth of high performance products. our manufacturing divisions have ens ured supreme quality and reliabi lity. and our sales teams and distribution partners have opened international markets to some of the best electronics solutions available. we hold all the necessary qualification a pprovals needed to serve t he military and hi-rel industries now including qml approval for a series of linear integrated circuits and qml approval for our laboratory test house capabilities. the test faci lities are available to qualify and screen third party products, including hybrid products not made by the group. we have the ability and considerable experience of most test methods currently demanded. we specialise in the fabrication of very hi gh quality products especia lly intended for use in high reliability applicati ons. we have supplied many millions of discrete and linear integrated circuits into all forms of hi gh reliability equipment such as: ? space satellite vehicles launchers support & defence ? aircraft military civil air traffic control ? communications secure communication links military links naval links broadcast transmitters underwater repeaters ? defence guided weapons electronic counter measures command & control radar ? transportation railway signalling systems traction systems automatic signalling systems ? harsh environment oil rig installations drill head sensors atomic event detectors --- everywhere when there is a need for co st effective ultra reliable products. this is semelab: design innovation, backed by numerous approvals and manufacturing strength and led by a total commitment to quality .
2 doc 2624 iss 5 2. quality approvals scheme description sml facilities approval (y/n) semelab approval no sml devices types approved remarks current schemes bs9000 british standards for linear ics and discrete semiconductors y detailed approval for many products 1360/m linear ics and discrete semiconductors replaced in many areas by cecc or dscc. approved suppliers and products listed in pd9002 bs en iso 9001:2000 international standard for quality assurance management of all phases in the provision of goods and services. replaces most of the old "national" systems. y fm36235 refers to all product types the whole semelab facility and all products conform with these norms. cecc 50000 european military quality approval system for discrete semiconductors y detailed approval for many products m/0103/cecc/ uk-1181m small signal discretes, power discretes european qpl. generally in decline cecc 90000 european military quality approval system for ics. y detailed approval for many products m/0103/cecc/ uk-1181m linear ics. european qpl. generally in decline dscc qpl approval us manufacturing approval accepted everywhere y detailed approval for large range of linear ics. cage no. u3158 linear ics detailed product approval by dscc - e.g. commonly called mil/883b for linear ics dscc qml approval us manufacturing approval accepted everywhere y dscc -vq-03- 003050 & dscc-vq-03- 003049 linear ics (level q certification) laboratory suitability will generally replace many of the older approval systems on international military systems. esa - escc 5000, scc 9000 european space agency y qpl no 253 2n2880 - more to follow product built & supplied in accordance with generic escc specifications stanag 4093 general reciprocal listing arrangement y all product types reciprocal qpl listing between europe and north america schemes being phased out aqap-1 applies in uk and related areas. replaced defence standard 05/21 y mod registration no.2m8s02 being superseded by bs/en/iso 9001 gamt1 french military approved products list y detailed approval for many products a large number french market - should be replaced by bs/en/iso9001 muahag european - military users and harmonisation advisory group y detailed approval for many products discrete products - volume 9. linears - volume 7 components generally for european military equipment makers - should be replaced by bs/en/iso9001 nato nato system applies to nato systems y listed for many products manufacturer code 3158 several hundred discrete products tending towards being a legacy system now legacy schemes cv very early uk approvals system for military and gpo types y some parts replaced by bs types, cecc or cvxxxx-0 parts legacy system - generally replaced by bs or cecc types def specs precursor of defence standard specifications many types - all built to order. replaced by defence standard specifications. generally already phased out. defence standards (many) relate to materials, components and processes for uk military use y for many products but under aqap1 and iso9001 discrete products legacy system little used now. the most common def stan relating to semiconductors is def stan 05/21 - replaced by aqap1 rre, rsre p & srde specifications specifications drawn up in support of mod projects y for many types discrete products legacy system little used now.
3 doc 2624 iss 5 2. material screening piece part ? qualification and pre- assembly approval process flow. before contemplating the assembly of any qualified semiconductor pr oduct, it is essential that all the materials used in the constructi on of the parts be obtained from fully qualified and trustworthy suppliers - those wi th a long continuous and successf ul supply history. little used or untried or suspect materials are thoroughl y checked and qualified as being suitable for their intended application before use. in this case, mechanical piece parts are subjec t to an exhaustive series of tests culminating in sample assemblies being built to establish lack of flaws and lack of unwanted difficulties during assembly. 3.1 header / cap / wire approval procedures incoming mechanical piece parts visual inspection dimensional check corrosion resistance mechanical strength visual die sort (before sample assembly) sample piece parts submitted to assembly vibration test temperature cycling acceleration sealing (leak) tests solderability tests electrical tests qualified (approved) mechanical piece parts available for assembly of hi-rel products. notes: approval procedures are performed on samples to approve each single lot of material. each batch of assembled piece parts carries its own unique ?date? code. traceability to each incoming batch of materials (all mechanical batches and die lots) is guaranteed from this unique number. qa inspection tests operation
4 doc 2624 iss 5 3.2 die approval procedure incoming wafer wafer saw wash & dry headers* (qualified) break into individual die clean visual die sort and tray die acceptance die attach die attach inspection aluminium wire bond bond inspection caps* (qualified) 100% optical inspection clean final pre-cap inspection vacuum bake final seal seal inspection final acceptance electrical yield forecasting qa acceptance tests 168 hour life and electrical tests final qa acceptance of the die lot. approved die (available for production) each batch of assembled piece parts carries its own unique ?date? code. traceability to each incoming batch of materials (all mechanical batches and die lots) is guaranteed from this unique number. the die qualification can include a 1000-hour el ectrical endurance test. one of the major objectives is to ensure that the die lot?s pe rformance stabilises rapidly during the initial portion of this period and then remain unc hanged throughout the remainder of the test (and life). die and mechanical piece parts intended for use in ultra-reliable applications e.g. space vehicles are subject to more rigorous evaluation. qa inspection tests operation
5 doc 2624 iss 5 4. cecc (discrete devices) registration: m/0103/cecc/uk semelab offers one of the largest ranges of cecc approved products in europe, including small signal and power devices. these devic es have undergone approval for use in new applications as well as providing c ontinuing support for existing applications. all piece parts used in the manufacture of cecc released products undergo stringent qualification procedures before they can be us ed. for further details contact our quality manager (qa@semelab.co.uk). full forward and backward traceability is maintained on all cecc released devices all cecc fully assessed devices are subject to groups a, b and c inspection carried out in the quality assurance department in lutterworth. as sessment is available to levels e, f & l. ordering information (example):- bds18cecc full assessment le vel (without additional screening) bds18cecc-b cecc full assessment level + sequence b screen 4.1 inspection levels for cecc fully assessed devices group a - lot by lot inspection il = inspection levels aql = acceptable quality level (%) levels of quality assessment examination or test level e level f & level l il aql observations il aql notes sub-group a1 visual inspection i 0.65 i 0.65 sub-group a2a non operatives ii 0.15 ii 0.15 sub-group a2b electrical measurements ii 0.40 primary dc characteristics ii 0.65 1.0 if < 4 tests if 4 tests sub-group a3 electrical measurements ii 0.65 other dc characteristics i i 2.5 4 if < 4 tests if 4 tests sub-group a4 electrical measurements s4 1 ac characteristics s4 s4 4 6.5 if < 4 tests if 4 tests
6 doc 2624 iss 5 cecc (discrete devices) (continued) group b - lot by lot inspection il = inspection level amb = ambient rated case = case rated aql in % c = acceptan ce criterion n = sample size levels of quality assessment examination or test level e level f level l n/c il aql il aql notes sub-group b1 dimensions 15/0 or 25/1 s2 2.5 s2 2.5 sub-group b2c verification of ratings 15/0 or 25/1 s4 4 na na see c2c sub-group b3 lead bending if applicable 15/0 or 25/1 s3 2.5 s2 4 sub-group b4 solderability 22/0 or 38/1 s4 2.5 s4 2.5 sub-group b5 change of temp followed by acc. damp heat or sealing 15/0 or 25/1 s4 2.5 na na see c5 sub-group b8 electrical endurance 38/1 or 52/2 s4 1.5 na na see c8 sub-group ctr unless otherwise stated in detail specification: attributes information for b3, b4, b5, b8 group c - periodic inspection p = periodicity (months) na= not applied levels of quality assessment examination or test e (p = 3 months) f (p = 3 months) l n/c notes n/c notes p n/c notes sub-group c1 dimensions 8/0 or 13/1 8/1 3 8/1 sub-group c2a electrical measurements 15/0 or 25/1 13/1 3 13/1 sub-group c2b complementary characteristics 32/0 or 55/1 15/0 or 25/1 versus t versus i,v 18/1 3 18/1 sub-group c2c verification of ratings 15/0 or 25/1 13/1 when not in b2c 3 8/1 sub-group c3 tensile / torque (if applicable) 15/0 or 25/1 8/1 6 8/1 sub-group c4 soldering heat 22/0 or 38/1 18/1 na na sub-group c5 change of temp followed by acc. damp heat or sealing na see b5 na see b5 3 13/1 sub-group c6 shock acceleration vibration 15/0 or 25/1 8/1 6 8/1 sub-group c7 damp heat (if applicable) 15/0 or 25/1 18/1 na na sub-group c8 electrical endurance 38/1 or 52/1 43/3 34/2 amb case 3 3 32/3 25/2 amb case sub-group c9 storage at high temp 38/1 or 52/2 43/3 34/2 amb case na na sub-group ctr unless otherwise stated in detail specification: attributes information for c3, c5, c6, c9. measurement information before and after c8
7 doc 2624 iss 5 cecc (discrete devices) (continued) 4.2 cecc screening options all cecc approved devices can be supplied as a st andard full assessment level part or with additional 100% screening to any of the four leve ls (a, b, c, d) in accordance to cecc 50000 appendix vi in addition, semelab can supply screening on pr oducts where the full device approval does not exist or is not held. screening is again ca rried out in accordance with any of the four levels within cecc 50000 appendix vi and is carried out at our factory in lutterworth. screening sequences are as laid out below:- sequence a sequence b sequence c sequence d 100% internal visual inspection 24 hour high temperature storage 24 hour high temperature storage 24 hour high temperature storage rapid change of temperature rapid change of temperature rapid change of temperature acceleration test acceleration test acceleration test fine & gross leak test fine & gross leak test fine & gross leak test test & record electrical characteristics test electrical characteristics test electrical characteristics 168 hour burn-in electrical operation (ambient rated) or high temperature reverse bias (case rated) 72 hour burn-in electrical operation (ambient rated) or high temperature reverse bias (case rated) 48 hour burn-in electrical operation (ambient rated) or high temperature reverse bias (case rated) test & record electrical characteristics test electrical characteristics test electrical characteristics test electrical characteristics
8 doc 2624 iss 5 5. bs (linear ic?s) registration 1360/m. semelab offers a range of bs approved linear ic?s including voltage regulators, pwm?s and control ic?s. these families of dev ices have undergone approval for use in new applications in addition to providing c ontinuing support for existing applications. full forward and backward traceability is maintained on all bs released devices all bs fully assessed devices are subject to gr oups a,b,c and d inspection carried out in the quality assurance department in lutterworth. scr eening is available to any of the four levels defined in bs9400 (s1, s2, s3, s4) the generic specifications for t hese devices are as follows: bs9400 ic?s - generic data & methods of test bs9430 linear voltage regulators bs9493 pwm and control ic?s ordering information (example):- ip117k-bss2 bs full assessment level + category s2 screening 5.1 inspection levels for bs fully assessed devices group a - lot by lot inspection il = inspection levels aql = acceptable quality level (%) levels of quality assessment examination or test il aql bs9400 observations sub-group a1 visual inspection i 1.5 1.2.2 sub-group a2 non operatives ii 0.15 sub-group a3a electrical measurements ii 1.5 static characteristics tamb=25c sub-group a3b electrical measurements ii 1.5 static characteristics tamb = tmax sub-group a3c electrical measurements ii 1.5 static characteristics tamb = tmin sub-group a4a electrical measurements s4 4% dynamic characteristics tamb = 25c
9 doc 2624 iss 5 bs (linear ic?s) (continued) group b - lot by lot inspection il = inspection levels aql = acceptable quality level (%) levels of quality assessment examination or test il aql bs 9400 observations sub-group b1 dimensions s2 6.5 1.2.3 sub-group b2a solderbility s4 4.0 1.2.6.15.1 sub-group b2b change of temp followed by sealing s4 4.0 1.2.6.13 1.2.6.14.1/2 sub-group b3 lead bending s3 6.5 1.2.6.16.2 sub-group b6 acceleration steady state s4 4.0 1.2.6.9 sub-group b7 electrical endurance s4 1.5 1.2.7.2.2 sub-group b8 ctr information unless otherwise stated in detail specification: attributes information for b2a, b2b, b6, b7 group c - periodic inspection il = inspection levels aql = acceptable quality level (%) levels of quality assessment examination or test il aql bs 9400 observations sub-group c1 dimensions s2 6.5 1.2.3 sub-group c3 vibration followed by shock followed by damp heat cycle s2 6.5 1.2.6.8.1 1.2.6.6 1.2.6.5 sub-group c5 electrical endurance s3 4.0 1.2.7.2.2 duration = 2000 hrs sub-group c6 ctr information s3 6.5 1.1.11 unless otherwise stated in detail spec: attributes information for c3 & c5
10 doc 2624 iss 5 bs (linear ic?s) (continued) 5.2 bs screening options (linear ic?s) category s1 category s2 category s3 category s4 100% internal visual inspection level a 100% internal visual inspection level b 100% internal visual inspection level b 24 hour high temperature storage 24 hour high temperature storage 24 hour high temperature storage rapid change of temperature rapid change of temperature rapid change of temperature shock acceleration test (direction y1, y2) acceleration test (direction y1) acceleration test (direction y1) fine & gross leak test fine & gross leak test fine & gross leak test test electrical characteristics test electrical characteristics test electrical characteristics 240 hour duration high temperature burn-in 160 hour duration high temperature burn-in 160 hour duration high temperature burn-in test electrical characteristics 72 hour duration high temperature reverse bias test electrical characteristics test electrical characteristics test electrical characteristics test electrical characteristics radiographic tests ( accept / reject criteria at every stage strictly as defined by the bs specifications ).
11 doc 2624 iss 5 6. dscc / 883b (linear ic?s) built on semelab?s qm l qualified production lines. cage number u3158 semelab offers a range of dscc smd list ed and 883b processed voltage regulators, pwm?s and control ic?s. all m anufacturing is carried out on our qml qualified lines in our lutterworth factory to the appropriate mil- std-883 specifications (5005 - processing and 5004 - screening). 6.1 inspection levels for ds cc smd listed devices method 5005: table i group a elec trical tests fo r class level b examination or test quality/accept observations sub-group 1 static tests 116/0 tamb = 25c sub-group 2 static tests 116/0 tamb = tmax sub-group 3 static tests 116/0 tamb = tmin sub-group 4 dynamic tests 116/0 tamb = 25c sub-group 5 dynamic tests 116/0 tamb = tmax sub-group 6 dynamic tests 116/0 tamb = tmin sub-group 7 functional tests 116/0 tamb = 25c sub-group 8a functional tests 116/0 tamb = tmax sub-group 8b functional tests 116/0 tamb = tmin sub-group9 switching tests 116/0 tamb = 25c sub-group10 switching tests 116/0 tamb = tmax sub-group11 switching tests 116/0 tamb = tmin 1) the specific parameters to be included for tests in each subgroup shall be as specified in the applicable acquisition document. where no parameters have been identified in a particular subgroup or tests within a subgroup, no group a testing is required for that subgroup or test to satisfy group a requirements. 2) when the (sub)lot size is less than the required sample size, each and every device in the (sub)lot shall be inspected and a ll failed devices removed from the (sub)lot for final acceptance of that test, subgroup, or set of tests/subgroups. method 5005: table iib group b tests for class level b test note mil-std-883 method condition quantity/accept or sample size/accept subgroup 2 resistant to solvents (3) 2015 3/0 subgroup 2 solderability (4) 20 03 soldering temp 245c 5c sample size number = 22, c = 0 subgroup 3 bond strength 1) thermo-compression 2) ultrasonic / wedge 3) flip-chip 4) beam lead (5) 2011 1) test condition c or d 2) test condition c or d 3) test condition f 4) test condition h sample size number = 15, c = 0 3) resistance to solvents testing required only on devices using inks or paints as the marking or contrast. 4) devices submitted for solderability shall be in the same lead finish as shipped product and must have been through the temp/time exposure of burn in except for devices which have been hot solder dipped or have lead-tin fusing after burn-in. 5) unless otherwise specified the sample size number for condition c or d is the number of bond pulls selected from a minimum number of 4 devices and for condition f or h is the number of dice (not bonds).
12 doc 2624 iss 5 dscc / 883b (linear ic?s) (continued) method 5005: table iii group c (die related tests) for class level b test mil-std-883 method condition quantity/accept or sample size/accept subgroup 1 a) steady-state life test 1005 test condition to be specified (1000 hours at 125c or equivalent in accordance with table 1) sample size number = 45, c = 0 b) end-point electrical parameters as specified in the applicable device specification method 5005: table iv group d (packa ge related tests) for class level b test (1) mil-std- 883 method condition quantity/accept or sample size/accept subgroup 1 (2) physical dimensions 2016 sample size number = 15, c = 0 subgroup 2 a) lead integrity (3) b) seal - fine & gross leak (5) 2004 1014 test condition b (lead fatigue) as applicable sample size number = 45, c = 0 subgroup 3 (4) a) thermal shock b) temp cycle c) moisture resistance d) visual examination e) seal - fine & gross leak f) end point electricals 1011 1010 1004 1014 test cond b as a min. 15 cycles min test condition c. 100 cycles min in accordance with visual criteria method 1004 and 1010 as applicable as specified in the applicable device specification sample size number = 15, c = 0 subgroup 4 (4) a) mechanical shock b) vibration, variable frequency c) constant acceleration d) seal - fine & gross leak e) visual examination f) end point electricals (6) 2002 2007 2001 1014 test condition b minimum test condition a minimum test condition e minimum (y1 only) in accordance with meth 1010 or 1101 as specified in applicable device specification sample size number = 15, c = 0 subgroup 5 (2) a) salt atmosphere b) visual examination c) seal - fine & gross leak 1009 1014 test condition a minimum in accordance with method 1009 sample size number = 15, c = 0 subgroup 6 (2) a) internal water-vapour content 1018 5000ppm max water content at 100c 3/0 or 5/1 subgroup 7 (2) a) adhesion of lead finish (12) 2025 sample size number = 15, c = 0 subgroup 8 (2) a) lid torque 2024 5/0 1) in line monitor data may be substituted for subgroups d1,d2,d6,d7 and d8 upon approval by the qualifying activity. the monitors shall be performed by package type and to the specified subgroup test method. 2) electrical reject devices from the same inspection lot may be used for samples. 3) the sample size number of 45, c=0 for lead integrity shall be based on the number of leads or terminals tested and shall be taken from a minimum of 3 devices. 4) seal tests need only be performed on packages having leads exiting through a glass seal. 5) devices used in subgroup 3 can be used in subgroup 4. 6) end point electrical parameters may be performed after moisture resistance and prior to seal test. 7) sample size based on number of leads.
13 doc 2624 iss 5 6.2 screening sequence for dscc smd listed devices method 5004: table 1 class level b screening screen mil-std-883 method condition requirement internal visual (1) 2 010 test condi tion b 100% stabilisation bake 1008 24hrs @ conditi on c minimum 100% temperature cycling (2) 1 010 test condi tion c 100% constant accelera tion 2001 test condi tion e minimum y1 orientation only 100% visual inspection 100% initial (pre-burn-in) (3) electrical parameters in accordance with applicable device specification 100% burn-in test 1015 160 hours at 125c minimum 100% interim (post burn-in) electrical parameters in accordance with applicable device specification 100% percentage defect allowable 5% all lots final electrical test a) static tests 1) 25c subgroup 1 table 1 5005 2) maximum and minimum rated operating temperature subgroup 2,3 table 1 5005 b) dynamic or functional tests 1) 25c subgroup 4,7 table 1 5005 2) minimum and maximum rated operating temperature subgroup 5,6,8 table 1 5005 c) switching tests at 25c subgroup 9 table 1 5005 in accordance with applicable device specification 100% 100% 100% 100% 100% seal (4) a) fine b) gross 1014 100% qualification or quality (5) conformance inspection test sample selection 5005 in accordance with applicable device specification sample external visual 2009 100% 1) test samples for group b, bond strength may be selected prior to or following internal visual, prior to sealing provided all other specification requirements are satisfied. test method 2010 applies in full except when method 5004, alt 1 or 2 is in effect. 2) this may be replaced with thermal shock method 1111, test condition a, minimum. 3) when specified in the applicable device specification, 100% of devices shall be tested for parameters requiring deltas. 4) fine & gross leak tests shall be performed separately or together between constant acceleration and external visual. all device lots having any physical processing steps performed following seal shall be retested for hermeticity and visual defects. 5) samples shall be selected for testing in accordance with the specific device class and lot requirement of method 5005.
14 doc 2624 iss 5 7. esa/escc - space level product semelab?s space quality level products are based on the testing procedures specified in the generic escc 5000 issue 3 and in the corresponding detail specifications . 7.1 chart f2 - production control ( escc 5000 issue 3 ) component lot manufacturing wafer lot acceptance para 5.3.1 process monitoring review para 5.3.2 sem inspection (1,3) para 5.3.3 total dose rad testing (1,4) special in - process controls para 5.2.1 internal visual inspection (pre-cap inspection) para 5.2.1 bond strength(pre-cap inspection) (1) para 5.2.1 die shear(pre-cap inspection) (1) para 5.2.1 encapsulation (pre-cap inspection) (1) para 5.2.1 dimension check (1) para 5.2.3 weight (2) to chart f3 (screening) notes: 1) performed on a sample basis. 2) guaranteed but not tested. 3) if specified in the detail specification. 4) if specified in the detail specification and required in the purchase order.
15 doc 2624 iss 5 7.2 esa/escc - chart f3 screening ( escc 5000 issue 3 ) components from production control para 8.5 high temperature stabilisation bake electrical test (11) para 8.6.1 temperature cycling acceleration (10) para 8.7 particle impact no ise detection (pind) para 8.22 verification of safe operating area (2,3) para 8.9.1 electrical measurements, serialisation and parameter drift values (initial measurements) (1) para 8.20 high temperature reverse bias burn-in (2) para 8.9.1 parameter drift values htrb final and power burn-in initial measurements (4) para 8.21 power burn-in (2) para 8.9.1 parameter drift values (final measurements) (4) para 8.9.2 high and low temperature electrical measurements (4,5) hot solder dip (if applicable) (6) para 8.3 radiographic inspection (9) para 8.8.1&2 seal (fine & gross leak) para 8.9.3 room temp electrical measurements (including ac) (4,7) para 6.4.1 check for lot failure (8) para 8.10 external visual inspection para 8.16 solderability (4,5) to chart f4 (validation testing) notes: 1) all components shall be serialised prior to initial electrical measurement. 2) if specified in detail spec. 3) can be performed at any time prior to initial measurements of parametric drift values. 4) the lot failure criteria of paragraph 6.4 applies to this test. 5) performed on a sample basis. 6) can be performed at any time prior to room temp electrical measurements during screening (prior to seal test). 7) measurements of parametric drift values need not be repeated in room temperatur e electrical measurements. 8) check for lot failure shall take into account all electrical parameter failures that may occur during screening. tests in accordance with paragraph 8.9.1, 8.9.2, 8.9.3 subsequent to htrb burn-in. 9) radiographic inspection may be performed at any point during screening tests. 10) not specified in escc 5000 iss 3, but performed by semelab to mil-std-750 method 2006. 11) not specified in escc 5000 iss 3, but performed by semelab as a process monitor.
16 doc 2624 iss 5 esa/escc (space level flow) (continued) 7.3 chart f4 - validation testing ( escc generic specification 5000 issue 3 ) components for validation lvt 1 (subgroup 1) mechanical & environmental lvt 2 (subgroup 2) endurance lvt 3 (subgroup 3) assembly capability 15 components 15 components 15 components 5 components mechanical shock para 8.11 thermal shock (2) para 8.14 operating life (4) 2000 hours data points: 0,1000, 2000 hrs para 8.19 vibration para 8.12 temp cycling (3) para 8.6.2 terminal strength para 8.18 constant acceleration para 8.13 moisture resistance para 8.15 immediate & end point electrical measurements para 8.9.4 internal visual inspection para 8.1 seal para 8.8.1 & 8.8.2 seal para 8.8.1 & 8.8.2 seal para 8.8.1 & 8.8.2 bond strength para 8.2.1 immediate & end point electrical measurements para 8.9.4 immediate & end point electrical measurements para 8.9.4 external visual inspection para 8.10 die shear para 8.2.2 external visual inspection para 8.10 external visual inspection para 8.10 permanence of marking para 8.17 lvt 1 (subgroup 1) lot validation lvt 2 (subgroup 2) lot validation lvt 3 (subgroup 3) lot validation notes: 1) escc 5000 iss 3 table f4 - qualification & periodic testing becomes ?validation testing? for non qualified parts. 2) only applicable to axial diodes. 3) not applicable to axial lead glass diodes. 4) variance in test method based on product type. ordering information: 1) order for subgroup 1 (includes subgroups 2 & 3) requires order for 50 (30+15+5) destructive samples. 2) order for subgroup 2 (includes subgroup 3) requires order for 20 (15+5) destructive samples. 3) order for subgroup 3 requires order for 5 destructive samples. 4) other ordering options are available - please contact semelab sales.
17 doc 2624 iss 5 8. semelab in-house processing options in addition to the numerous qualifications held by semelab, there are also other processing options available. these are based on semela b?s own in house specifications that have been written around a range of exis ting generic specifications. these specifications enable semelab to supply products processed to the requirements of original manufacturers? data sheets and military or space specifications (ie bs, cv, cecc, mil-prf-19500 all levels, esa, 883b) before assembly of any qualified semiconductor produc t is started, it is essential that all the materials used in the construction of the par ts be of known and proven high quality. they may be obtained from fully qualified and trusted s uppliers - those with a long continuous and successful supply history. little used or untri ed or suspect materials are thoroughly checked and qualified as being suitable for their intended application before assembly is allowed to start. all products processed in this way are releas ed in accordance with the company?s defence standard approvals. 8.1 cecc processed devices qr208: conformance to the requirements of cecc 50000 qr209: screening to the requirements of cecc 50000 app vi qr208 and qr209 are based entirely on cecc 50000 quality conformance inspection requirements and screening options. by working to these specifications semelab are able to supply full cecc ?look alike? products, but released under the company?s iso9001/aqap1 approval. standard processing is done in accordance with group a (electrical) and group b (environmental) tests to full assessment level f. group c tests and level e assessment levels are optional and are available on customer request. part numbers for products processed to qr208 and qr209 have -qr added (and a letter corresponding to the screening level if required) . the marking for the device has the suffix ?- o? added (and a letter corresponding to the screening level if screened). semelab are also able to process devices to existing cecc specifications where we have not undergone an approval exercise. this is partic ularly useful when semelab want to supply products in a smaller volume that does not justify the cost of the full approval exercise . part numbers for parts processed to detailed s pecifications will have the suffix ?-o? added to the original part number (and a letter correspondi ng to the screening level if required). the marking for the device has the suffix ?-o? added (and a letter corresponding to the screening level if screened).
18 doc 2624 iss 5 ordering information (when no cecc specification exists):- part number description marking (*) 2n5153-qr qr208 gps a, b level f processed to cecc full assessment level f, groups a, b 2n5153-o 2n5153-qr-b qr208 gps a, b level f + qr209 sequence b processed to cecc full assessment level f, groups a, b with screening in accordance with cecc 50000 app vi seq b 2n5153-o/b 2n5153-qr-eb qr208 gps a, b level e + qr209 sequence b processed to cecc full assessment level e, groups a, b with screening in accordance with cecc 50000 app vi seq b 2n5153-o/b 2n5153-qr-ebc qr208 gps a, b, c level e + qr209 sequence b processed to cecc full assessment level e, groups a, b, c with screening in accordance with cecc 50000 app vi seq b 2n5153-o/b * where space permits 8.2 bs and cv processe d devices (bipolar) semelab can also provide look alike devices against bs specifications. this can be carried out against any of the bs detail device specific ations, including those where the original manufacturer has ceased production. semelab c an also supply old type cv devices which have been converted into the bs system. product is processed to the requirements of group a (electrical) and group b (mechanical and environmental) tests of bs detail device specif ications. parts processed in accordance with these specifications are marked with t he suffix ?-o? added to the original part number. screening can also be carried out agains t the bs sequences a,b,c,d if required ordering information (example): part number description marking (*) bft69-o requirements of bs9365-f005 groups a & b bft69-o bft69-o-b requirements of bs9365-f005 groups a & b with screening in accordance with bs sequence b bft69-0/b cv7xxx-0 requirements of bs 9300 cxxx groups a,b cvxxx-o * where space permits
19 doc 2624 iss 5 8.3 mil-prf-19500 processed discret e semiconductors qr205: ?mil processed? full quality conformance inspection (mil-prf-19500) qr204: ?mil processed? discrete component screening (mil-prf-19500) semelab?s qr205 and qr204 processing specificati ons, in conjunction with the company?s aqap1 / iso 9001 approval present a viable alternative to the american mil approved parts from a european manufacturer. semelab qr205 (quality conformance) is based on the quality conformance inspection requirements of mil-prf-19500 groups a (table v), b (table vib), c (table vii). semelab qr204 (screening options) is based on the screening options and requirements of mil-prf-19500 (table iv). full details of semelab qr205 and qr204 are included in the following pages, showing sample sizes and test methods used. all manufacture and processing is carried out on our approved high-rel assembly line in our lutterworth factory and product is released under the company?s aqap1 defence standard approval. the table below shows part number examples and corres ponding processing options and marking. the device marking will also contai n the semelab identifier (sml) plus the date code where space permits. ordering information: (examples) part number description marking (*) 2n2369-jqr qr205 groups a,b 2n2369-jqr 2n2369-jqrb qr205 groups a,b screening to qr204 level b 2n2369-jqrb 2n2369-jqra qr205 groups a,b screening to qr204 level a 2n2369-jqra 2n2369-jqrs space level ? see section 8.4 (qr216 & qr217) qr217 groups a,b screening to qr216 2n2369-jqrs * where space permits
20 doc 2624 iss 5 mil-prf-19500 processed discrete semiconductors (continued) 8.3.1 ?mil processed? full quality conformance inspection (ref: mil-prf-19500) qr205: group a - electrical tests * small lot conformance subgroup description ltpd sample* reject 1 visual + mechanical inspection 5 45 0 2 dc electrical tests at 25c 5 45 0 3 dc electrical tests at maximum and minimum rated operating temperature 30 8 0 4 ac electrical tests at 25c 30 8 0 5 safe operating area (power transistors) a) dc b) clamped inductive c) unclamped inductive endpoint electrical measurements 30 8 0 the specified parameters to be included in each subgroup shall be as per the detail specification. where no parameters have been specified in a particular subgroup or test within a subgroup, no group a testing is required for that subgroup or test to satisfy group a requirements. a single sample may be used for all subgroup testing. these tests are considered non- destructive. qr205: group b - short term environmental & endurance tests * small lot conformance test note mil-std-750 method condition sample* reject subgroup 1 solderability resistant to solvents (1) (3) 2026 1022 separate samples can be used for each test 4 leads 3 devices 1 subgroup 2 thermal shock (temperature cycling) hermetic seal (a) fine leak (b) gross leak electrical measurements 1051 1071 no dwell is required at 25c. test condition c1 (25 cycles), temp extreme, 10 mins test condition g or h. max leak =5x10 -8 atm cc/s, (5x10 -7 atm cc/s for <0.3cc) 6 0 subgroup 3 steady-state operation life or intermittent operation life or blocking life electrical measurements (4) 1027 1037 - 340hrs at specified bias conditions as specified 12 0 subgroup 4 internal visual design verification (5) 2075 visual criteria in accordance with qualified design. 1 0 subgroup 5 thermal resistance qa1023 as specified ref semelab spec 6 0 subgroup 6 high temperature life (non operating) electrical measurements 1032 340hrs high temperature storage as specified 12 0
21 doc 2624 iss 5 mil-prf-19500 processed discrete semiconductors (continued) qr205: group c - periodic inspection (chargeable option on request) * small lot conformance test note mil-std-750 method condition sample * reject subgroup 1 physical dimensions 2066 dimensions per case outline specified 6 0 subgroup 2 thermal shock (glass strain) terminal strength hermetic seal (a) fine leak (b) gross leak moisture resistance electrical measurements 1056 2036 1071 1071 1021 test condition a, except for devices > 10w at t=25which is condition b as specified a) test condition h. max leak rate =5x10 -8 atm cc/s, (5x10 -7 atm cc/s for internal cavity <0.3cc) b) test condition c omit initial conditioning as specified 6 0 subgroup 3 shock vibration (variable frequency) constant acceleration electrical measurements (4) 2016 2056 2006 non-operating, 1500g, 0.5ms, 5 blows in each orientation, x1, y1, z1 i minute min. in each orientation, x1, y1, z1 at 20000g min except at 10000g min if device 15w at t c =25c as specified 6 0 subgroup 4 salt atmosphere (corrosion) (1) 1041 6 0 subgroup 5 thermal resistance 3131 3161 3101,4081 as specified: bipolar transistors mosfets diodes 6 0 subgroup 6 steady-state operation life or intermittent operation life or blocking life electrical measurements 1026 1036 1000hrs at max operating junction temp as specified 12 0 1) electrical reject devices from the same inspection lot may be used for all subgroups when electrical end point measurements are not required. 2) post burn-in electrical rejects may be used. 3) the ltpd for solderability test applies to the number of leads inspected except in no case shall less than three devices be used to provide the number of leads required. 4) if a given inspection lot undergoing group b inspection has been selected to satisfy group c inspection requirements, the 340 hour life test may be continued to 1000 hours in order to satisfy the group c life test requirements. in such cases, either the 340 hour end point measurements must be made as a basis for group b lot acceptance or the 1000 hour end point measurement shall be used as the basis for both group b and group c acceptance. 5) subgroup 4 may be omitted if the devices have been manufactured by semelab as sample pre-cap visual inspection will have been performed.
22 doc 2624 iss 5 mil-prf-19500 processed discrete semiconductors (continued) 8.3.2 ?mil processed? discrete compone nt screening (ref: mil-prf-19500) qr204: discrete component screening (with reference to mil-std-750) description mil-std-750 method conditions jqr-a jqr-b 1 internal visual (precap) inspection 2069 2070 2072 100% n/a 2 high temperature stabilisation bake 1032 24 hrs min at rated maximum storage temperature 100% 100% 3 temperature cycling 1051 20 cycles at -55c to +175c or max storage temp (whichever is lower) with minimum 10 minutes dwell time 100% 100% 4 constant acceleration 2006 20,000g force in y1axis for 1 min duration (see note 2) 100% 100% 5 particle impact noise detection (pind) 2052 6 hermeticity a) fine b) gross 1071 1071 test condition h. max leak rate =5x10 - 8 atm cc/s, (5x10 -7 atm cc/s for internal cavity <0.3cc) condition c 100% 100% 100% 100% 7 device serialisation 8 interim electrical 100% 100% 10 high temperature reverse bias a) bipolar b) power mosfet c) diodes 1039 1042 1038 test condition a test condition b test condition a 100% 100% 11 interim electrical group a (read & record) 100% 100% 12 power burn-in a) bipolar b) power mosfet c) diodes d) case mounted rectifiers 1039 1042 1038 1038 test condition b - 160 hrs min test condition a - 160 hrs min test condition b - 96 hrs min test condition a ? 48 hrs min 100% 100% 13 final electrical group a read & record +drift check (1) 100% 100% 14 radiographic tests (x-ray) 2076 notes: 1) group a end point tests are dc functional / parametric at 25c (subgroup 2) of qr205. 2) 10000g force for devices with power rating >10 watts at t c =25c. 3) pda (percentage defects allowable) is 10% between steps 9 & 11 and 11& 13.
23 doc 2624 iss 5 8.4 ?space level processed? discrete semiconductors. qr217: ?space level? full qual ity conformance inspection. qr216: ?space level? discrete component screening semelab?s qr217 and qr216 processing specificati ons, in conjunction with the company?s aqap1 / iso 9001 approval present a viable al ternative to american mil-prf-19500 space level parts supplied from a european manufac turer and esa / escc 5000 space level parts. qr217 (quality conformance) is based on the quality conformance inspection requirements of mil-prf-19500 groups a (table v), b (tab le via), c (table vii) and esa / escc 5000 (chart f4) lot validation tests. qr216 (screening) is based on the screening requirements of mil-prf-19500 (table iv) and esa /escc 5000 (chart f3) details of qr217 and qr216 are included in the following pages. all manufacture and processing is carried out on our approved high-rel assembly line in our lutterworth factory and product is releas ed under our aqap1 defence standard approval. the ?standard? jqrs part is processed to the semelab data sheet, screened to qr216 and has conformance testing to q217 groups a and b. additional options are available as shown below. these are chargeable and must be specifi ed at order stage. the extensions on the semelab part numbers used reflect these additional items. additional options available : 1) customer pre-cap vis ual inspection (suffix p) 2) data pack supplied (suffix d) 3) group c tests (suffix c) ordering information: (examples) part number description marking (*) 2n2369-jqrs qr217 groups a,b screening to qr216 2n2369-jqrs 2n2369-jqrs -c qr217 groups a,b and group c. screening to qr216 2n2369-jqrs 2n2369-jqrs -cd qr217 groups a,b and group c. screening to qr216 with data pack 2n2369-jqrs 2n2369-jqrs -pcd qr217 groups a,b and group c. screening to qr216 with customer pre-cap visual inspection & data pack 2n2369-jqrs * where space permits notes: 1) ?additional options? (customer pre-cap visual inspection, group c?s, datapack) are chargeable and must be specified at order stage. 2) ?additional options? are reflected in the semelab part number, but do not affect device marking.
24 doc 2624 iss 5 ?space level processed? discrete semiconductors (continued) 8.4.1 qr217 ?space level? full quality conformanc e inspection. qr217: group a - electrical tests * small lot conformance subgroup description sample* reject 1 visual + mechanical inspection 20 0 2 dc electrical tests at 25c 20 0 3 dc electrical tests at maximum and minimum rated operating temperature 8 0 4 ac electrical tests at 25c 8 0 5 safe operating area (power transistors) endpoint electrical measurements 8 0 the specified parameters to be included in each subgroup shall be as per the semelab data sheet. where no parameters have been specified in a particular subgroup or test within a subgroup, no group a testing is required for that subgroup or test to satisfy group a requirements. a single sample may be used for all subgroup testing. these tests are considered non- destructive. qr217: group b - short term environmental & endurance tests * small lot conformance test note mil-std-750 method condition sample* reject subgroup 1 physical dimensions 2066 as per specification 8 0 subgroup 2 solderability resistant to solvents (3) (3) 2026 1022 separate samples can be used for each test 6 devices 0 subgroup 3 thermal shock (temperature cycling) hermetic seal (a) fine leak (b) gross leak electrical measurements 1051 1071 no dwell is required at 25c. test condition c1 (25 cycles), temp extreme, 10 mins (100 cycles covered by mil883 group d programme) test condition g or h. max leak =5x10 -8 atm cc/s, (5x10 -7 atm cc/s for <0.3cc) 6 0 subgroup 4 steady-state operation life or intermittent operation life or blocking life electrical measurements (4) 1027 1037 - 340hrs at specified bias conditions as specified 12 0 internal visual design verification 2075 visual criteria in accordance with qualified design. 5 0 bond strength 2037 11 wires 0 subgroup 5 thermal resistance qa1023 as specified - semelab spec 6 0 subgroup 6 high temperature life (non operating) electrical measurements 1032 340hrs high temperature storage as specified 12 0 see notes at bottom of group c table.
25 doc 2624 iss 5 ?space level processed? discrete semiconductors (continued) qr217: group c - periodic inspection (chargeable option on request ) * small lot conformance test note mil-std-750 method condition sample * reject subgroup 1 physical dimensions 2066 dimensions per case outline specified 6 0 subgroup 2 & 3 thermal shock (glass strain) shock vibration (variable frequency) constant acceleration hermetic seal (a) fine leak (b) gross leak moisture resistance terminal strength electrical measurements 1056 2016 2056 2006 1071 1071 1021 test condition a, except for devices > 10w at t=25 which is condition b non-operating, 1500g, 0.5ms, 5 blows in each orientation, x1, y1, z1 1 minute min. in each orientation y1 at 20000g min except at 10000g min if device 15w at t c =25c a) test condition h. max leak rate =5x10 -8 atm cc/s, (5x10 -7 atm cc/s for internal cavity <0.3cc) b) test condition c omit initial conditioning as specified as specified 6 0 subgroup 4 salt atmosphere (corrosion) (2) 1041 covered by mil883 ongoing group d programme 6 0 subgroup 5 thermal resistance 3131 3161 3101,4081 as specified: bipolar transistors mosfets diodes 6 0 subgroup 6 steady-state op lifen life or intermittent operation life or blocking life electrical measurements (4) 1026 1036 1000hrs at max operating junction temp as specified 12 0 subgroup 7 internal water vapour (2) covered by mil883b ongoing group d programme 3 0 1) individual subgroups may be performed on representative parts from the same package family. 2) electrical reject devices from the same inspection lot may be used for all subgroups when electrical end point measurements are not required. 3) post burn-in electrical rejects may be used. 4) if a given inspection lot undergoing group b inspection has been selected to satisfy group c inspection requirements, the 340 hour life test may be continued to 1000 hours in order to satisfy the group c life test requirements. in such cases, either the 340 hour end point measurements must be made as a basis for group b lot acceptance or the 1000 hour end point measurement shall be used as the basis for both group b and group c acceptance.
26 doc 2624 iss 5 ?space level processed? discrete semiconductors (continued) 8.4.2 qr216: ?space level? di screte component screening qr216: discrete component screening (with reference to mil-std-750) description mil-std-750 method conditions jqr-s 1 internal visual (pre-cap) inspection 2069, 2070 2072 100% 2 customer pre cap visual inspection 2069, 2070 2072 customer specified option (chargeable) 100% 3 high temperature stabilisation bake 1032 24 hrs min at rated maximum storage temperature 100% 4 temperature cycling 1051 20 cycles at -55c to +175c or max storage temp (whichever is lower) with minimum 10 minutes dwell time 100% 5 constant acceleration 2006 20,000g force in y1axis for 1 min duration (see note 2) 100% 6 particle impact noise detection (pind) 2052 (full yielded quantity) 100% 7 device serialisation 8 interim electrical read & record 100% 9 high temperature reverse bias a) bipolar b) power mosfet c) diodes 1039 1042 1038 test condition a test condition b test condition a 100% 10 interim electrical (note 3) read & record, drift check 100% 11 power burn-in a) bipolar b) power mosfet c) diodes 1039 1042 1038 test condition b - 240 hrs min test condition a - 240 hrs min test condition b - 240 hrs min 100% 12 final electricals (note 3) read & record, drift check (1) 100% 13 a) hermeticity - fine b) hermeticity - gross 1071 1071 test condition h. max leak rate =5x10 -8 atm cc/s, (5x10 -7 atm cc/s for internal cavity <0.3cc) condition c 100% 100% 14 radiographic tests (x-ray) 2076 (may be performed at any time after serialization) 100% 15 external visual inspection 2071 notes: 1) group a end point tests are dc functional / parametric at 25c (subgroup 2) of qr217. 2) 10000g force for devices with power rating >10 watts at t c =25c. 3) pda (percentage defects allowable) is 10% between steps 8 & 10 and 10 & 12.
27 doc 2624 iss 5 ?space level processed? discrete semiconductors (continued) 8.4.3 comparison of space level die lot approval procedures. the table below shows a comparison of operati ons carried out for die approval within the generic approval systems (mil-prf-19500 space level and esa / escc 5000. it must be noted that sem and rha total dose evaluation are options only available within mil-prf- 19500 and esa / escc 5000. sem and rha total dose evaluation are not available within the semelab jqr-s processing options. if sem and/or rha total dose evaluation are required then the ese / escc 5000 procedures must be followed ? see section 7 ? esa / escc space level products. space level/ die lot acceptance table generic sml die lot acceptance escc jans jqr-s selected wafer ? ? ? probe test (100%) ? ? ? glassivation / metalisation inspection ? ? ? visual inspection (100%) ? ? ? sample assembly (10 pcs) ? ? ? stabilization ? ? ? temperature cycling ? ? ? electrical test (read/record) ? ? ? htrb ? ? ? electrical test (read/record) ? ? ? steady state life (1000 hrs) ? ? ? electrical test (read/record) ? ? ? wire bond evaluation ? ? ? die shear evaluation ? ? ? sem opt opt - rha total dose evaluation opt opt - die lot acceptance table
28 doc 2624 iss 5 8.5 ?mil883b processed? in tegrated circuits qr215: ?mil processed /883b? full quality conformance inspection for linear integr ated circuits a and b, c and d optional) qr214: ?mil processed /883b? linear integrated circuit component screening semelab?s qr214 and qr215 are based on mil-std-883e, method 5005 quality conformance, inspection requirem ents and method 5004 screening methods. semelab qr215 (quality conformance) covers t he control procedures for group a (electrical), group b (environmental), group c (die related) and group d (package related) tests. it is based on method 5005 conformance proce dures and mil-std-883e test methods semelab qr214 (screening) is based on me thod 5004 screening procedures and mil-std-883e test methods. ordering information : devices screened in accordance with semel ab qr214 and qr215 are identified using the standard product part number with the addition of the suffix ??8qrb?. example: lm117h built and screened to t he mil883b flows method 5005 and method 5004 in accordance with qr214 and qr215 is: lm117h-8qrb device marking :- xxx-8qrb for products equivalent to mil883b parts - e.g. lm117h-8qrb + sml + dc 8.6 customer specifications semelab is also able to offer release on all pa rts manufactured in acco rdance with customers own ?in-house? or national spec ifications. both lot accept ance and screening options can be met. manufacturing is carried out to many cust omers? special requirem ents for the uk, europe, usa and elsewhere. ordering information:- customer part number and specification 8.7 data sheets many products can be processed in accordance with the origi nal manufacturer?s data sheets (jedec or pro-eletron registered). product c an be supplied with fully traceable certificate of conformity under semelab?s company aqap1 / iso 9001 approval. this can be also be done in cases where the original supplier has ceased production. ordering information:- 2n5000 with aqap1 / iso 9001 release ordered as follows: 2n5000.mod
29 doc 2624 iss 5 9. comparison of screening options (discrete devices) 9.1 comparison of high-rel screening opt ions (discrete devices) the table below shows the com parison of screening options avai lable within the cecc, bs and mil approvals. comparison is also show n with semelab?s in-house qr204 options. ? test performed test performed if required by device detail specification { 24 hours for pnp devices. 48 hours for npn devices ? high temp reverse bias for case rated devices power burn-in for ambient rated devices cecc / qr209 : screening carried out in accordance with cecc 50000 appendix 6 bs : screening carried out in accordance with bs9300 section 1.2.10 qr216 : screening carried out in accordance with semelab qr216 qr204 : screening carried out in accordance with semelab qr204 mil : screening carried out in accordance with mil-prf-19500 (table 2) * full jantx, jantxv not available from semelab cecc / qr209 bs 9300 qr204 mil a b c d a b c d jqra jqrb jan* txv jan* tx pre-cap visual ? ? ? ? ? high temp storage ? ? ? ? ? ? ? ? ? ? temperature cycle 5 cycles 5 cycles 5 cycles 10 cycles 10 cycles 10 cycles 20 cycles 20 cycles 20 cycles 20 cycles constant acceleration ? ? ? ? ? ? ? ? ? ? particle impact noise detection (pind) fine leak test ? ? ? ? ? ? ? ? ? ? gross leak test ? ? ? ? ? ? ? ? ? ? device serialisation variables electrical test ? ? attributes electrical tests ? ? ? ? ? ? ? ? ? burn-in (htrb) 168 hrs ? 72 hrs ? 48 hrs ? 160 hrs ? 72 hrs ? 48 hrs ? 48 hrs ? { { { { variables electrical test attributes electrical tests ? ? ? ? burn-in (power) 168 hrs ? 72 hrs ? 48 hrs ? 160 hrs ? 72 hrs ? 48 hrs ? 48 hrs ? 160 hrs 160 hrs 160 hrs 160 hrs variables electrical test ? ? attributes electrical tests ? ? ? ? ? ? ? ? ? ? radiographic tests ?
30 doc 2624 iss 5 comparison of screening options ( discrete devices ) ( continued ) 9.2 comparison of space level screening options space level flow comparison table generic qr216 screening escc jans* jqrs pre-cap visual ? ? ? customer pre-cap visual opt opt opt high temp storage (stabilization bake) 24 hrs 24 hrs 24hrs temperature cycling 20 cycles 20 cycles 20 cycles thermal impedance opt { - constant acceleration ? ? pind ? ? ? fine/gross leak ? ? ? serialization ? ? ? interim electrical measurements - - - interim electrical measurements (read and record / drift) ? ? ? htrb ? ? ? electrical measurements - - - parametric drift measurements (read and record / drift) ? ? ? burn-in min 168 hrs max 264 hrs 240 hrs 240hrs electrical measurements - - - parameter drift measurements (read and record) ? ? ? pda calculations ? ? ? read and record test data ? ? ? other electrical parameters (temp, dynamic) ? ? ? fine/gross leak ? ? ? radiography ? ? ? external visual inspection ? ? ? *jans part not available from semelab. notes: { if specified in detail specification. not specified in escc 5000 iss 3, but performed by semelab.

fet devices homepage divisions tech nologies search tools resources corporate part number search for devices beginning "irf9130smd05dsg" semelab home datasheets are downloaded as acrobat pdf files. product status screening options available polarity package v dss (v) i d(cont) (a) p d (w) r dss ( ? ) c iss (pf) q g (nc) irf9130smd05dsg p-channel smd0.5 (to276aa) 100v 11a 45w 0.3 ? 860pf 29nc screening options availability (including cecc, mil-prf-19500, bs) symbol indicates that screening op tions are available for this device. for device-specific screening options and orde r information, click the relevant symbol. for more information on screening options, visit the screening homepage. top of page if you are unable to find a suitable part, please contact us . pa g e 1 of 1 part number search for devices be g innin g "irf9130smd05dsg" 30-oct-2006 mhtml:file://\\ g aruda\automation\automation _ cpr\10192006\seme\irf913...
fet devices homepage divisions tech nologies search tools resources corporate part number search for devices beginning "irf9130smd05" semelab home datasheets are downloaded as acrobat pdf files. product status screening options available polarity package v dss (v) i d(cont) (a) p d (w) r dss ( ? ) c iss (pf) q g (nc) irf9130smd05 p-channel smd0.5 (to276aa) 100v 11a 45w 0.3 ? 860pf 29nc irf9130smd05dgs p-channel smd0.5 (to276aa) 100v 11a 45w 0.3 ? 860pf 29nc irf9130smd05dsg p-channel smd0.5 (to276aa) 100v 11a 45w 0.3 ? 860pf 29nc screening options availability (including cecc, mil-prf-19500, bs) symbol indicates that screening options are available for this device. for device-specific screening options and orde r information, click the relevant symbol. for more information on screening options, visit the screening homepage. top of page if you are unable to find a suitable part, please contact us . pa g e 1 of 1 part number search for devices be g innin g "irf9130smd05" 30-oct-2006 file://\\ g aruda\automation\automation _ cpr\10192006\seme\irf9130smd...

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